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? semiconductor components industries, llc, 2016 july, 2016 ? rev. 16 1 publication order number: ncp380/d ncp380, ncv380 fixed/adjustable current\limiting power\distribution switches the ncp380 is a high side power-distribution switch designed for applications where heavy capacitive loads and short-circuits are likely to be encountered. the device includes an integrated 55 m (dfn package), p-channel mosfet. the device limits the output current to a desired level by switching into a constant-current regulation mode when the output load exceeds the current-limit threshold or a short is present. the current-limit threshold is either user adjustable between 500 ma and 2.1 a via an external resistor or internally fixed. the power-switch rise and fall times are controlled to minimize current ringing during switching. an internal reverse-voltage detection comparator disables the power-switch if the output voltage is higher than the input voltage to protect devices on the input side of the switch. the flag logic output asserts low during over current, reverse-voltage or over temperature conditions. the switch is controlled by a logic enable input active high or low. features ? 2.5 v ? 5.5 v operating range ? 70 m high-side mosfet ? current limit: ? user adjustable from 500 ma to 2.1 a ? fixed 500 ma, 1 a, 1.5 a, 2 a and 2.1 a ? under voltage lock-out (uvlo) ? built-in soft-start ? thermal protection ? soft turn-off ? reverse voltage protection ? junction temperature range: ?40 c to 125 c ? enable active high or low (en or en ) ? compliance to iec61000?4?2 (level 4) ? 8.0 kv (contact) ? 15 kv (air) ? ul listed ? file no. e343275 ? ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these are pb-free devices typical applications ? laptops ? usb ports/hubs ? tvs udfn6 case 517ab marking diagrams www.onsemi.com xxm 1 2 3 6 5 4 tsop?5 case 483 1 5 xxxayw (note: microdot may be in either location) tsop?6 case 318g xxx = specific device code a =assembly location m = date code y = year w = work week = pb?free package xxxayw 1 see detailed ordering and shipping information in the package dimensions section on page 20 of this data sheet. ordering information udfn6 tsop?5 tsop?6
ncp380, ncv380 www.onsemi.com 2 figure 1. typical application circuit *for adjustable version only. in gnd usb input 5 v flag en r fault 100 k 1 f flag en ncp380 out ilim* usb data usb port d+ d? vbus gnd r lim 120 f (top view) figure 2. pin connections 1 2 3 6 5 4 out ilim* flag in gnd en pad1 udfn6 out gnd flag in en 1 2 3 5 4 tsop?5 1 2 3 6 4 out ilim* 5 flag in gnd en tsop?6 *for adjustable version only, otherwise not connected. table 1. pin function description pin name type description en input enable input, logic low/high (i.e. en or en) turns on power switch gnd power ground connection; in power power-switch input voltage; connect a 1 f or greater ceramic capacitor from in to gnd as close as pos- sible to the ic. flag output active-low open-drain output, asserted during overcurrent, overtemperature or reverse-voltage conditions. connect a 10 k or greater resistor pull-up, otherwise leave unconnected. out output power-switch output; connect a 1 f ceramic capacitor from out to gnd as close as possible to the ic is recommended. a 1 f or greater ceramic capacitor from out to gnd must be connected if the usb requirement (i.e.120 f capacitor minimum) is not met. ilim* input external resistor used to set current-limit threshold; recommended 5 k < r ilim < 250 k . pad1** thermal exposed thermal pad: must be soldered to pcb ground plane *(for adjustable version only, otherwise not connected. **for dfn version only.
ncp380, ncv380 www.onsemi.com 3 table 2. maximum ratings rating symbol value unit from in to out pins: input/output (note 1) v in , v out ?7.0 to +7.0 v in, out, en, ilim, flag , pins: input/output (note 1) v en, v ilim, v flag, v in, v out ?0.3 to +7.0 v flag sink current i sink 1 ma i lim source current i lim 1 ma esd withstand v oltage (iec 61000?4?2) (output only , when bypassed with 1.0 f capacitor minimum) esd iec 15 air, 8 contact kv human body model (hbm) esd rating (note 2) esd hbm 2,000 v machine model (mm) esd rating (notes 2 and 3) esd mm 200 v latch-up protection (note 4) pins in, out, en, ilim, flag lu 100 ma maximum junction temperature range (note 6) t j ?40 to +tsd c storage temperature range t stg ?40 to +150 c moisture sensitivity (note 5) msl level 1 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. according to jedec standard jesd22?a108. 2. this device series contains esd protection and passes the following tests: human body model (hbm) 2.0 kv per jedec standard: jesd22?a114 for all pins. machine model (mm) 200 v per jedec standard: jesd22?a115 for all pins. 3. except en pin, 150 v. 4. latch up current maximum rating: 100 ma per jedec standard: jesd78 class ii. 5. moisture sensitivity level (msl): 1 per ipc/jedec standard: j?std?020. 6. a thermal shutdown protection avoids irreversible damage on the device due to power dissipation. table 3. operating conditions symbol parameter conditions min typ max unit v in operational power supply 2.5 ? 5.5 v v en enable voltage 0 ? 5.5 t a ambient temperature range ?40 25 +85 c t j junction temperature range ?40 25 +125 c r ilim resistor from ilim to gnd pin 5.0 ? 250 k i sink flag sink current ? ? 1.0 ma c in decoupling input capacitor 1.0 ? ? f c out decoupling output capacitor usb port per hub 120 ? ? f r ja thermal resistance junction-to-air udfn?6 package (notes 7 and 8) ? 120 ? c/w tsop?5 package (notes 7 and 8) ? 305 ? c/w tsop?6 package (notes 7 and 8) ? 280 ? c/w i out maximum dc current udfn?6 package ? ? 2.1 a tsop?5, tsop?6 package ? ? 1.0 a p d power dissipation rating (note 9) t a 25 c udfn?6 package ? 830 ? mw tsop?5 package ? 325 ? mw tsop?6 package ? 350 ? mw t a = 85 c udfn?6 package ? 325 ? mw tsop?5 package ? 130 ? mw tsop?6 package ? 145 ? mw 7. a thermal shutdown protection avoids irreversible damage on the device due to power dissipation. 8. the r ja is dependent of the pcb heat dissipation. board used to drive this data was a 2? 2? ncp380evb board. it is a 2 layers board with 2-once copper traces on top and bottom of the board. exposed pad is connected to ground plane for udfn?6 version only. 9. the maximum power dissipation (p d ) is given by the following formula: p d t jmax t a r ja
ncp380, ncv380 www.onsemi.com 4 table 4. electrical characteristics (min & max limits apply for t a between ?40 c to +85 c and t j up to +125 c for v in between 2.5 v to 5.5 v (unless otherwise noted). typical values are referenced to t a = +25 c and v in =5v.) symbol parameter conditions min typ max unit power switch r ds(on) static drain-source on-state resistance dfn package tsop package v in = 5 v ?40 c < t j < 125 c ? 55 75 m 2.5 v < v in < 5.5 v ?40 c < t j < 125 c ? ? 110 v in = 5 v ?40 c < t j < 125 c ? 70 95 m 2.5 v < v in < 5.5 v ?40 c < t j < 125 c ? ? 135 t r output rise time v in = 5 v c load = 1 f, r load = 100 (note 10) 0.3 1.0 1.5 ms v in = 2.5 v 0.2 0.65 1.0 t f output fall time v in = 5 v 0.1 ? 0.5 v in = 2.5 v 0.1 ? 0.5 enable input en or en v ih high-level input voltage 1.2 ? ? v v il low-level input voltage ? ? 0.4 v i en input current v en = 0 v, v en = 5 v ?0.5 ? 0.5 a t on turn on time c load = 1 f, r load = 100 (note 11) 2.0 3.0 4.0 ms t off turn off time 1.0 ? 3.0 ms current limit i ocp current-limit threshold (maximum dc output current i out delivered to load) v in = 5 v r ilim = 20 k (note 11) 1.02 1.20 1.38 a r ilim = 40 k (notes 11 and 13) 0.595 0.700 0.805 fixed 0.5 a (note 12) 0.5 0.58 0.65 a fixed 1.0 a (note 12) 1.0 1.15 1.3 fixed 1.5 a (note 12) 1.5 1.75 1.9 fixed 2.0 a (note 12) 2.0 2.25 2.5 fixed 2.1 a (note 12) 2.1 2.25 2.5 t det response time to short circuit v in = 5 v ? 2.0 ? s t reg regulation time 1.8 3.0 4.0 ms t ocp overcurrent protection time 14 20 26 ms reverse-voltage protection v rev reverse-voltage comparator trip point (v out ? v in ) ? 100 ? mv t rev time from reverse-voltage condition to mosfet switch off & flag low v in = 5 v 4.0 6.0 9.0 ms t rrev re-arming time 7.0 10 15 ms undervoltage lockout v uvlo in pin low-level input voltage v in rising 2.0 2.3 2.4 v v hyst in pin hysteresis t j = 25 c 25 ? 60 mv t ruvlo re-arming time 7.0 10 15 ms supply current i inoff low-level output supply current v in = 5 v, no load on out, device off v en = 0 v or v en = 5 v ? 1.0 2.1 a i inon high-level output supply current v in = 5 v, device enable 2 a and 2.1 a versions 1 a and 1.5 a current versions 0.5 a current version ? ? ? ? ? ? 90 80 70 a i rev reverse leakage current v out = 5 v, v in = 0 v t j = 25 c ? ? 1.0 a
ncp380, ncv380 www.onsemi.com 5 table 4. electrical characteristics (continued) (min & max limits apply for t a between ?40 c to +85 c and t j up to +125 c for v in between 2.5 v to 5.5 v (unless otherwise noted). typical values are referenced to t a = +25 c and v in =5v.) symbol unit max typ min conditions parameter flag pin v ol flag output low voltage i flag = 1 ma 400 mv i leak off-state leakage v flag = 5 v 1.0 a t flg flag deglitch flag de-assertion time due to overcurrent or reverse voltage condition 4.0 6.0 9.0 ms t focp flag deglitch flag assertion due to overcurrent 6.0 8.0 12 ms thermal shutdown t sd thermal shutdown threshold 140 c t sdocp thermal regulation threshold 125 c t rsd thermal shutdown rearming threshold 115 c product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 10. parameters are guaranteed for c load and r load connected to the out pin with respect to the ground, see figure 3 . 11. adjustable current version, r ilim tolerance 1%. 12. fixed current version. 13. not production test, guaranteed by characterization. figure 3. test configuration in r load 1 f ncp380 out c load gnd vin figure 4. voltage waveform v en v en v out t on t off 50% 90% 10% v out t r t f 90% 10% 10%
ncp380, ncv380 www.onsemi.com 6 block diagram figure 5. block diagram blocking control gate driver control logic and timer en block vref tsd uvlo osc current limiter flag in ilim* gnd en out /flag *for adjustable version only, otherwise not connected.
ncp380, ncv380 www.onsemi.com 7 t on + t r figure 6. t on delay and t rise time t off + t fall figure 7. t off delay and t fall
ncp380, ncv380 www.onsemi.com 8 figure 8. turn on a short t reg tocp tsd warning figure 9. 2 short on output. complete regulation sequence
ncp380, ncv380 www.onsemi.com 9 figure 10. ocp regulation and tsd warning event t focp tsd warning t reg tocp figure 11. timer regulation sequence during 2 overload v in v out i in /flag
ncp380, ncv380 www.onsemi.com 10 figure 12. direct short on out pin figure 13. from timer regulation to load removal sequence
ncp380, ncv380 www.onsemi.com 11 t focp figure 14. from no load to direct short circuit v rev t frev figure 15. reverse voltage detection v out i out /flag v out v in /flag
ncp380, ncv380 www.onsemi.com 12 t rrev figure 16. reverse voltage removal figure 17. undervoltage threshold (falling) and hysteresis temperature ( c) uvlo (v) ?50 2.2 uvlo vs. temperature 0 50 100 150 2.22 2.24 2.26 2.28 2.3 2.32 2.34 2.36 2.38 2.4 uvlo ? hysteresis vs. temperature
ncp380, ncv380 www.onsemi.com 13 low?level output supply current vs vin 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.4 2.9 3.4 3.9 4.4 4.9 5.4 vin(v) i inoff ( a) ?40 c 25 c 85 c 125 c figure 18. standby current vs vin high?level output supply current vs vin 0 10 20 30 40 50 60 70 80 90 100 2.4 2.9 3.4 3.9 4.4 4.9 5.4 vin(v) i inon ( a) ?40 c 25 c 85 c 125 c figure 19. quiescent current vs vin
ncp380, ncv380 www.onsemi.com 14 figure 20. r ds(on) vs temperature, tsop package figure 21. r ds(on) vs temperature, dfn package tsop package temperature ( c) r ds(on) (m ) r ds(on) vs. temperature dfn package temperature ( c) r ds(on) (m ) ?50 ?40 ?30 ?20 ?10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 40 45 50 55 60 65 70 75 80 85 90 95 100 r ds(on) vs. temperature ?50 ?40 ?30 ?20 ?10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 40 45 50 55 60 65 70 75 80 85 90 95 100
ncp380, ncv380 www.onsemi.com 15 functional description overview the ncp380 is a high side p channel mosfet power distribution switch designed to protect the input supply voltage in case of heavy capacitive loads, short circuit or over current. in addition, the high side mosfet is turned off during under voltage, thermal shutdown or reverse voltage condition. adjustable version allows the user to program the current limit threshold using an external resistor. thanks to the soft start circuitry, ncp380 is able to limit large current and voltage surges. overcurrent protection ncp380 switches into a constant current regulation mode when the output current is above the i ocp threshold. depending on the load, the output voltage is decreased accordingly. ? in case of hot plug with heavy capacitive load, the output voltage is brought down to the capacitor voltage. the ncp380 will limit the current to the i ocp threshold value until the charge of the capacitor is completed. figure 22. heavy capacitive load v out i out drop due to capacitor charge i ocp ? in case of overload, the current is limited to the i ocp value and the voltage value is reduced according to the load by the following relation: v out r load i ocp (eq. 1) figure 23. overload i out v out i ocp r load i ocp ? in case of short circuit or huge load, the current is limited to the i ocp value within t det time until the short condition is removed. if the output remains shorted or tied to a very low voltage, the junction temperature of the chip exceeds t sdocp value and the device enters in thermal shutdown (mosfet is turned-off). figure 24. short circuit v out thermal regulation threshold timer regulation mode i out i ocp t ocp t reg then, the device enters in timer regulation mode, described in 2 phases: ? off-phase: power mosfet is off during t ocp to allow the die temperature to drop. ? on-phase: regulation current mode during t reg. the current is regulated to the i ocp level . the timer regulation mode allows the device to handle high thermal dissipation (in case of short circuit for example) within temperature operating condition. ncp380 stays in on-phase/off-phase loop until the over current condition is removed or enable pin is toggled. remark : other regulation modes can be available for different applications. please contact our on semiconductor representative for availability. flag indicator the flag pin is an open-drain mosfet asserted low during over current, reverse-voltage or over temperature conditions. when an over current or a reverse voltage fault is detected on the power path, flag pin is asserted low at the end of the associate deglitch time (see electrical characteristics). thanks to this feature, the flag pin is not tied low during the charge of a heavy capacitive load or a voltage transient on output. deglitch time is t focp for over current fault and t rev for reverse voltage. the flag pin remains low until the fault is removed. then, the flag pin goes high at the end of t fgl . undervoltage lock-out thanks to a built-in under voltage lockout (uvlo) circuitry, the output remains disconnected from input until v in voltage is below v uvlo . when v in voltage is above v uvlo , the system try to reconnect the output after a rearming time. t ruvlo . this circuit has a v hyst hysteresis witch provides noise immunity to transient. thermal sense thermal shutdown turns off the power mosfet if the die temperature exceeds t sd . a hysteresis prevents the part from turning on until the die temperature cools at t rsd.
ncp380, ncv380 www.onsemi.com 16 reverse voltage protection when the output voltage exceeds the input voltage by v rev voltage during t rev , the reverse voltage circuitry disconnects the output in order to protect the power supply. the same time t rev is needed to turn on again the power mos plus a rearming time t rrev . enable input enable pin must be driven by a logic signal (cmos or ttl compatible) or connected to the gnd. v in and en should not be connected together directly. v in should be well established and stablized prior to enabling the ic. if no separate en signal is available, a 10 k /100 nf rc network can be added between v in and en to delay the en signal. a logic low on en or high on en turns-on the device. a logic high on en or low on en turns off device and reduces the current consumption down to i inoff . blocking control the blocking control circuitry switches the bulk of the power mos. when the part is off, the body diode limits the leakage current i rev from out to in. in this mode, anode of the body diode is connected to in pin and cathode is connected to out pin. in operating condition, anode of the body diode is connected to out pin and cathode is connected to in pin preventing the discharge of the power supply. application information power dissipation the junction temperature of the device depends on different contributing factors such as board layout, ambient temperature, device environment, etc... yet, the main contributor in terms of junction temperature is the power dissipation of the power mosfet. assuming this, the power dissipation and the junction temperature in normal mode can be calculated with the following equations: r d r ds ( on ) i out 2 (eq. 2) where: p d = power dissipation (w) r ds(on) = power mosfet on resistance ( ) i out = output current (a) t j p d r ja t a (eq. 3) where: t j = junction temperature ( c) r ja = package thermal resistance ( c/w) t a = ambient temperature ( c) power dissipation in regulation mode can be calculated by taking into account the drop v in ?v out link to the load by the following relation: p d v in r load i ocp i ocp (eq. 4) where: p d = power dissipation (w) v in = input voltage (v) r load = load resistance ( ) i ocp = output regulated current (a) adjustable current-limit programming (for adjustable version only) the ncp380xmuajaa and ncp380xsnajaa, respectively dfn and tsop6 packages, are proposed to have current limit flexibility for end customer. indeed, ilim pin is available to connect pull down resistor to ground, which participate to the current threshold adjustment. it?s strongly recommended to use 0.1 or 1% resistor tolerance to keep the over current accuracy. for this resistance selection, customer should define first of all, the usb current to sustain, without the device enters in the protection sequence. main rule is to select this pull down resistor in order to make sure min current limit is above the usb current to provide continuously to the upstream accessory. following, the main table selection contains the usb current port for the accessory, the standard resistor selection and typical/max over current threshold.
ncp380, ncv380 www.onsemi.com 17 table 5. resistor selection for adjustable current limit version min current limit value (a) theoric resistor value (k ) selected resistor value (k ) 1% or 0.1% typical ocp target value (a) maximum current value (a) 0.5 44.2 44.2 0.59 0.67 0.6 37.5 37.4 0.71 0.81 0.7 32.2 31.6 0.825 0.95 0.8 27.7 27.4 0.94 1.08 0.9 24.0 23.7 1.06 1.22 1.0 21.0 21 1.18 1.35 1.1 18.5 18.2 1.3 1.49 1.2 16.6 16.5 1.41 1.62 1.3 14.6 14.3 1.53 1.76 1.4 13.0 13 1.65 1.9 1.5 11.4 11.3 1.78 2.05 1.6 10.4 10.2 1.88 2.17 1.7 9.2 9.09 2.01 2.31 1.8 8.3 8.25 2.12 2.438 1.9 7.4 7.32 2.23 2.56 2.0 6.5 6.49 2.36 2.7 2.1 5.6 5.49 2.48 2.85 the ?min current limit value? column, represents the dc current to provide to the accessory without over current activation. second column is the theoretical resistor value obtained with following formula to achieve typical current target: rlim ?5.2959 ilim 5 45.256 ilim 4 155.25 ilim 3 274.39 ilim 2 267.6 ilim 134.21 (eq. 5) figure 25. r lim curve vs. current limit rlim versus ocp average current limit (a) r lim (k ) 0 0 r lim vs. ocp average 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48
ncp380, ncv380 www.onsemi.com 18 when the resistor is choosing to fit with the customer application, the limits of the over current threshold can be calculated with the following formula: 0.0000009 (rlim 22.375) 4 iocp min 1.6915129 0.0330328 rlim 0.0011207(rlim 22.375 ) 2 0.0000451 (rlim 22.375 ) 3 (eq. 6) iocp max 2.2885175 0.0446914 rlim 0.0015163(rlim 22.375) 2 0.000061 (rlim 22.375) 3 0.0000012 (rlim 22.375) 4 (eq. 7) iocptyp 1.9900152 0.0388621 rlim 0.0013185(rlim 22.375) 2 0.0000531 (rlim 22.375) 3 0.0000011 (rlim 22.375) 4 (eq. 8) the minimum, typical and maximum current curves are described in the following graph: figure 26. current threshold vs. rlim resistor i lim (a) 5 0 iocp min vs. r lim r lim (k ) iocp vs. r lim iocp max vs. r lim 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 that is recommended to respect 6 k ?47 k resistor range for two reasons. for the low resistor values, the current limit is pushed up to high current level. due to internal power dissipation capability, a maximum of 2.4 a typical can be set for the dfn package if thermal consideration are respected. for the tsop6 version 1.2 a is the maximum recommended value because the part could enter in thermal shutdown mode before constant current regulation mode. in the other side, if we want to keep 15% of accuracy, high resistor values can be used up to 50 k . with higher value, the current threshold is lower than 500 ma, so in this case degraded accuracy can be observed. pcb recommendations the ncp380 integrates a pmos fet rated up to 2 a, and the pcb design rules must be respected to properly evacuate the heat out of the silicon. the udfn6 pad1 must be connected to ground plane to increase the heat transfer if necessary. this pad must be connected to ground plane. by increasing pcb area, the r ja of the package can be decreased, allowing higher power dissipation .
ncp380, ncv380 www.onsemi.com 19 power supply ncp380 in 4.7 f 10 f 100 f out ilim /flag in gnd en 1 2 3 6 5 4 gpm21br61c106ke15l gpm31cr60j107me39l ldo 3.3 v out in gnd 1 2 3 usb port vbus d+ d? gnd 5 2 3 4 1 10 12 11 gnd vcc usb transceiver vbus(sense) d+ d? gnd crtl[x:0] data[x:0] gnd vcc crtl_in[x:0] data_in[x:0] en status crtl_out[x:0] data_out[x:0] sys system usb host controller usb transceiver 12 11 10 5 2 3 4 1 d+ d? gnd vbus usb port downstream usb port vbus(sense) d+ d? gnd gnd vcc crtl[x:0] data[x:0] upstream usb port figure 27. usb host typical application
ncp380, ncv380 www.onsemi.com 20 table 6. ordering information device marking active enable level over current limit evaluation board ul listed cb scheme package shipping ? ncp380lsnajaat1g aac low adj. ncp380lsnajagevb y y tsop?6 (pb?free) 3,000 tape / reel ncp380lsn05aat1g ac5 0.5 a ncp380lsn05agevb y y tsop?5 (pb?free) ncp380lsn10aat1g ac6 1.0 a ncp380lsn10agevb y y ncp380lmuajaatbg aa adj. ncp380lmuajagevb y y udfn6 (pb?free) ncv380lmuajaatbg* an adj. ncp380lmuajagevb y y ncp380lmu05aatbg ae 0.5 a ncp380lmu05agevb y y ncp380lmu10aatbg af 1.0 a ncp380lmu10agevb y y ncp380lmu15aatbg ag 1.5 a ncp380lmu15agevb y y ncv380lmu15aatbg* aq 1.5 a ncp380lmu15agevb y y ncp380lmu20aatbg al 2.0 a ncp380lmu20agevb y y ncp380hsnajaat1g aad high adj. ncp380hsnajagevb y y tsop?6 (pb?free) ncp380hsn05aat1g ac7 0.5 a ncp380hsn05agevb y y tsop?5 (pb?free) NCP380HSN10AAT1G ada 1.0 a ncp380hsn10agevb y y ncp380hmuajaatbg ac adj. ncp380hmuajagevb y y udfn6 (pb?free) ncv380hmuajaatbg* ap adj. ncp380hmuajagevb y y ncp380hmu05aatbg ah 0.5 a ncp380hmu05agevb y y ncp380hmu10aatbg aj 1.0 a ncp380hmu10agevb y y ncp380hmu15aatbg ak 1.5 a ncp380hmu15agevb y y ncp380hmu20aatbg am 2.0 a ncp380hmu20agevb y y ncp380hmu21aatbg au 2.1 a ncp380hmu21agevb y y ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *ncv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable
ncp380, ncv380 www.onsemi.com 21 package dimensions udfn6 2x2, 0.65p case 517ab issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. 5. tie bars may be visible in this view and are connected to the thermal pad. seating plane 0.10 c a3 a a1 0.10 c dim a min max millimeters 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.25 0.35 d 2.00 bsc d2 1.50 1.70 0.80 1.00 e 2.00 bsc e2 e 0.65 bsc l --- 0.15 l1 pin one reference 0.08 c 0.10 c 6x l e e2 b 3 6 6x 1 4 d2 bottom view 0.25 0.35 l1 detail a l alternate terminal constructions l ??? ??? ?? *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 2.30 0.65 0.47 6x dimensions: millimeters 0.40 1.70 pitch 0.95 6x 1 package outline recommended top view side view detail b note 4 detail a end view a m 0.10 b c m 0.05 c d e a b note 5 c
ncp380, ncv380 www.onsemi.com 22 package dimensions tsop?5 case 483?02 issue k notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view
ncp380, ncv380 www.onsemi.com 23 package dimensions case 318g?02 issue v 23 4 5 6 d 1 e b e1 a1 a 0.05 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e1 do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimensions d and e1 are determined at datum h. 5. pin one indicator must be located in the indicated zone. c *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max millimeters 0.90 1.00 1.10 a1 0.01 0.06 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26 d 2.90 3.00 3.10 e 2.50 2.75 3.00 e 0.85 0.95 1.05 l 0.20 0.40 0.60 0.25 bsc l2 ? 0 1 0 1.30 1.50 1.70 e1 e recommended note 5 l c m h l2 seating plane gauge plane detail z detail z 0.60 6x 3.20 0.95 6x 0.95 pitch dimensions: millimeters m p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncp380/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.

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